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  MkFF SMT Cleaning Roll
Laminated high quality wood pulp material and spun laced fabric
  1. Strong resisting properties on solvents.
  2. Multi-plies for extra absorbency and wipe dry.
  3. Ideal for class and smooth surface cleaning.
  4. No streaks.
  5. Reinforced for extra durability.
  6. Resist tearing.
  7. Highly absorbent in water, grease and oil.

Laser Cut Stencil
Laser Stencil, highly recommended for electronics PCB design.Laser cutting process is a subtractive process, the process use laser beam to form apertures. The inherent advantagesof this process lie in its ability to form very fine aperture sizes with consistent accuracy.

Electroform Stencils are meant for wafer and super fine pitch design commonly found in semicon production. Is an additive process. In this process, nickel is deposited on a copper mandrel to build the apertures. A photosensitive dry film is laminated on the copper foil. This is polymerized by the UV light through a photomask of the stencil pattern. After developing, a negative image is created on the mandrel where only the apertures on the stencil remain covered by the photoresist. The stencil is developed by growing nickel plating around the photoresist. The photoresist is then removed after the desired thickness is achieved. This process is the most stencil manufacturing processes and is best suited for very small aperture sizes and fine pitches. COB Mask are stencils made from electroform technology. This is intend to use mainly for PCB with COB prior to paste printing. The height of Step Up is high, giving enough room for protruding COB.
  Step/ Multi Level Stencil
Step Down Stencil is use for some designs that requires minimal deposit of solderpaste. On the other hand, Step Up Stencil is use to compensate some height that affect printing in copper land. Step process involves checmical etching to reduce the foil thickness on some areas and then followed by laser cutting for actual aperture opening.
  MkFF Hi Temp Polymide Tape
Polyimide film is synthesized by polymerizing PMDA and ODA in strong polar solvents through the process of forming film and IMINE treatment at high temperature, which possesses excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant, it performs successfully in the wide range of temperature as low as -452f (-269c) and as high as +500f (+260c). Because of its unique excellent properties, it is the most ideal choice in many applications.

For wrapping of magnet wire and cable, slot liner insulation, interlayer insulation in motor, transformer etc.

  1. The backing material for pressure-sensitive adhesive tape, f46 (FEP) tape.
  2. The substrates or overlay of flexible printed circuits board (F-PCB).
  3. Plastic/Paper Tubing
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